NUMERICAL INVESTIGATION OF FLOW ENTERING THE TOP OF THE WAFER IN SINGLE-WAFER WET CLEANER

S.H. Park; C. Lee

doi:10.6112/kscfe.2024.29.1.045

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Original Article

NUMERICAL INVESTIGATION OF FLOW ENTERING THE TOP OF THE WAFER IN SINGLE-WAFER WET CLEANER 단일-웨이퍼 습식 세정 장비에서 웨이퍼 상부로 들어오는 유동의 수치해석

31 March 2024. pp. 45-60

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Abstract

This study investigates factors contributing to process defects in the single wafer wet cleaner equipment used for semiconductor wet cleaning processes. For a possible cause of defects in the cleaning process, we suspect the presence of a radially inward flow during the drying step where the cleaning process is completed. We explore the complex flow characteristics of the rotational structure to investigate the backflow in the radial direction. The wafer rotation structure, with a disk-shaped coaxial design, induces radial backflow on the wafer side. On the other hand, when a guide structure is present, backflow occurs along the guide, and it was observed that the flow through the guide structure increases with an increase in exhaust pressure. Backflow through the lower part of the guide, influenced by the vortex generated by exhaust pressure and guide, was identified. We propose a method to improve backflow by adjusting the position of the guide edge to enhance the inflow through the guide's upper part.

Keywords

전산유체역학(CFD)

회전체 유동(Rotating body flow)

반도체 장비(Semiconductor Equipment)

난류(Turbulence)

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Information

Publisher :Korean Society for Computational Fluids Engineering
Publisher(Ko) :한국전산유체공학회
Journal Title :Journal of Computational Fluids Engineering
Journal Title(Ko) :한국전산유체공학회지
Volume : 29
No :1
Pages :45-60
Received Date : 2023-12-08
Revised Date : 2024-01-04
Accepted Date : 2024-01-05
DOI :https://doi.org/10.6112/kscfe.2024.29.1.045

Journal of Computational Fluids Engineering ISSN:1598-6071(Print) 3022-6252(Online) 한국전산유체공학회지

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