Original Article
2017, Lee, S., “Fundamentals of thermal compression bonding technology and process materials for 2.5/3D packages,” 3D Microelectronic Packaging: From Fundamentals to Applications, Springer, pp. 157-203.
2015, Yang, L., Tian, D., Cheung, Y.M. and Li, M., “Investigation of key factors in thermal compression (TCB) NCF bonding process,” IEEE 17th Electronics Packaging and Technology Conference, pp. 1-5.
10.1109/EPTC.2015.74123822021, Moon, J.Y., Shin, Y., Kim, S., Hahn, S.H., Lim, K., Jung, W.J., Lim, C., Kim, Y., Hwang, J. and Rhee, M.D., “Non Conductive Film Analysis Using Cure Kinetics and Rheokinetics for Gang Bonding Process for 3DIC TSV Packaging,” IEEE 71st Electronic Components and Technology Conference, pp. 706-710.
10.1109/ECTC32696.2021.001222018, Lee, H., Lee, S., Park, J., Chung, C.K., Jang, K.W., Kim, I., Choi, S. and Paik, K.Y., “A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly,” IEEE 68th Electronic Components and Technology Conference, pp. 2464-2469.
10.1109/ECTC.2018.003712014, Chang, C.H. and Young, W-B., “Modeling and numerical study of thermal-compression bonding in the packaging process using NCA,” Appl. Math. Model., Vol. 38, No. 11, pp. 3016-3030.
10.1016/j.apm.2013.11.0262015, Che, F.X., Lin, J.K., Au, K.Y., Hsiao, H.Y. and Zhang, X., “Stress Analysis and Design Optimization for Low-k Chip With Cu Pillar Interconnection,” IEEE Trans. Compon. Packag. Manuf. Technol., Vol. 5, No. 9, pp. 1273-1283.
10.1109/TCPMT.2015.24610202015, Oliver, M. and Elabbasi, N., “Multiphysics modeling of underfill flow and cure during thermocompression bonding,” International Symposium on Microelectronics, Vol. 2015, No. 1, pp. 526-529.
10.4071/isom-2015-WP652017, Athia, D., Rezvani, A., Clauberg, H., Qin, I. and Mayer, M., “Numerical Simulations of Joint-to-Joint Temperature Variation During Thermo-Compression Bonding,” IEEE 67th Electronic Components and Technology Conference, pp. 1906-1915.
10.1109/ECTC.2017.832020, Autret, M., “Calcul du coefficient de constriction du flux thermique dans une matrice d'interconnexions en micro-électronique,” Université de Sherbrooke, Master Thesis.
2020, Xiong, W. and Cheng, P., “A 3D numerical study of a molten solder droplet's wetting and solidifying on a pillar with application to electronic packaging,” Int. J. Heat Mass Transf., Vol. 153, p. 119585.
10.1016/j.ijheatmasstransfer.2020.1195852025, Thirumalaisamy, R. and Bhalla, A.P.S., “A consistent, volume preserving, and adaptive mesh refinement-based framework for modeling non-isothermal gas-liquid-solid flows with phase change,” Int. J. Multiph. Flow., Vol. 183, p. 105060.
10.1016/j.ijmultiphaseflow.2024.1050601982, Castro, J.M. and Macosko, C.W., “Studies of mold filling and curing in the reaction injection molding process,” AIChE J., Vol. 28, No. 2, pp. 250-260.
10.1002/aic.6902802131973, Kamal, M.R. and Sourour, S., “Kinetics and thermal characterization of thermoset cure,” Polym. Eng. Sci., Vol. 13, No. 1, pp. 59-64.
10.1002/pen.760130110- Publisher :Korean Society for Computational Fluids Engineering
- Publisher(Ko) :한국전산유체공학회
- Journal Title :Journal of Computational Fluids Engineering
- Journal Title(Ko) :한국전산유체공학회지
- Volume : 31
- No :2
- Pages :104-116
- Received Date : 2026-04-20
- Revised Date : 2026-05-29
- Accepted Date : 2026-06-01
- DOI :https://doi.org/10.6112/kscfe.2026.31.2.104
Journal of Computational Fluids Engineering
